Accelsius, a pioneer in two-phase, direct-to-chip liquid cooling, has been selected as a key contributor to a U.S. Department of Energy (DOE) ARPA-E COOLERCHIPS project. The project, “Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future,” will develop a next-generation hybrid architecture that combines direct-to-chip evaporative cooling with air-based solutions such as rear door heat exchangers.
Accelsius will support system-level testing by providing its proprietary MR250, a multi-rack, in-row, 250kW two-phase Coolant Distribution Unit (2P CDU), along with comprehensive integration support. The MR250 will be incorporated into the project’s test infrastructure at the UT Arlington campus, with general availability planned for late 2025.
The COOLERCHIPS (Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems) program aims to transform how high-density data centers are cooled. The goal is to reduce total cooling energy consumption to less than 5% of a data center’s IT load—while maintaining reliability and enabling next-generation high-density compute.