Schneider Electric has introduced a new portfolio of end-to-end liquid cooling solutions designed for hyperscale, colocation, and high-density data centers—purpose-built to support AI and high-performance computing (HPC) workloads.
Available globally, the Motivair by Schneider Electric solutions are engineered to meet the power and GPU-intensive demands of modern data centers with reliability and scalability. The comprehensive portfolio spans both liquid and air-cooled technologies, including coolant distribution units (CDUs), rear door heat exchangers (RDHx), heat dissipation units (HDUs), chillers, and more—alongside integrated software and services for optimized thermal management.
Each solution is designed to efficiently handle the high thermal loads of next-generation AI and accelerated computing environments, enabling the data centers that power tomorrow’s “AI factories.”